Sunday, July 02, 2006

 

Adapter brings 0.8mm-pitch BGAs into line

A new Correct-A-Chip BGA adapter allows 0.8mm pitch devices to be mounted to PCBs laid out for 1.0mm pitch devices, eliminating the need for new or reworked PCBs.
Aries Electronics has introduced a new Correct-A-Chip ball grid array (BGA) adapter that allows 0.8mm pitch devices to be mounted to PCBs laid out for 1.0mm pitch devices, eliminating the need for new or reworked PCBs. The bottom of the new adapter mounts on a PCB with a BGA pad footprint on 1.0mm pitch, while the top of the adapter accepts BGA devices with 0.8mm pitch. The new 16 x 16 array (256-ball) BGA adapter measures 0.65in square and is constructed of 0.040 FR-4 material with 0.02in diameter solder balls of tin/lead 63/37.

PCB plating is immersion gold over electroless nickel per ASTM-B-733.

The adapter's solder mask is black liquid photo imagable (LPI), and operating temperature is 105C continuous.

Suggested PCB pad sise diameter for mounting is 0.635mm.

In addition to these standard materials, Aries can furnish the new adapter using special materials, platings, sizes and configurations to meet specific customer needs.

Pricing for the new Correct-A-Chip adapter 256-301750-18 starts at $110 each in single piece quantities.





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