Thursday, April 20, 2006
Microwave simulator has flexible inputs
Version 7.5 of MicroStripes 3D EM simulation solution for RF/microwave and antenna design integrates with Applied Wave Research's Microwave Office circuit design software.
Flomerics has introduced version 7.5 of its MicroStripes 3D EM simulation solution for RF/microwave and antenna design which integrates with Applied Wave Research's (AWR) Microwave Office circuit design software. 'MicroStripes v7.5 operates seamlessly as a plug-in to Microwave Office, providing high-frequency RF and microwave circuit designers with proven, full-wave 3D solver capabilities required by complex high frequency design issues and time-to-market cycles', said the EM Product Line Manager at Flomerics. The new version of MicroStripes enables users to import any desired excitation waveform during the modelling process, run the simulation, and evaluate the results without any additional postprocessing.
This makes it possible, for example, to simulate the effect of a lightning strike, electromagnetic pulse (EMP) or electrostatic discharge (ESD) on a system using a precomputed, analytic or measured waveform.
In version 7.5, ground planes can also be used for models without meshing all of the space between the system and ground plane.
A specific algorithm accounts for the effects of the ground plane outside of the simulation domain, substantially reducing solution time.
MicroStripes 7.5 reduces the computational resources required to model ferrite tiles by providing its unique SmartPart compact model methodology of ferrite tile absorber which incorporates the effects of the tiles into the simulation without having to include them in the mesh.
In a recent benchmark of an anechoic chamber performed by Siepel, the ferrite tile SmartPart reduced solution time by a factor of 15 without sacrificing accuracy.
Flomerics has introduced version 7.5 of its MicroStripes 3D EM simulation solution for RF/microwave and antenna design which integrates with Applied Wave Research's (AWR) Microwave Office circuit design software. 'MicroStripes v7.5 operates seamlessly as a plug-in to Microwave Office, providing high-frequency RF and microwave circuit designers with proven, full-wave 3D solver capabilities required by complex high frequency design issues and time-to-market cycles', said the EM Product Line Manager at Flomerics. The new version of MicroStripes enables users to import any desired excitation waveform during the modelling process, run the simulation, and evaluate the results without any additional postprocessing.
This makes it possible, for example, to simulate the effect of a lightning strike, electromagnetic pulse (EMP) or electrostatic discharge (ESD) on a system using a precomputed, analytic or measured waveform.
In version 7.5, ground planes can also be used for models without meshing all of the space between the system and ground plane.
A specific algorithm accounts for the effects of the ground plane outside of the simulation domain, substantially reducing solution time.
MicroStripes 7.5 reduces the computational resources required to model ferrite tiles by providing its unique SmartPart compact model methodology of ferrite tile absorber which incorporates the effects of the tiles into the simulation without having to include them in the mesh.
In a recent benchmark of an anechoic chamber performed by Siepel, the ferrite tile SmartPart reduced solution time by a factor of 15 without sacrificing accuracy.
# posted by Swathi @ 11:34 AM
Tuesday, April 18, 2006
EDA tools lead to SiGe:C BiCMOS process
Users of Tanner EDA tools are to get economical access to an analogue and mixed-signal 0.25um SiGe:C BiCMOS process through a new collaboration with IHP's pilot line in Frankfurt.
Users of Tanner EDA tools are to get economical access to an analogue and mixed-signal 0.25um silicon germanium carbon (SiGe:C) BiCMOS process through a new collaboration with IHP's pilot line in Frankfurt (Oder). Europractice has developed design kits for Tanner EDA's L-Edit family of integrated circuit layout tools to ensure compatibility of designs with their process. Using the IHP pilot line, Europractice IC Services will provide low-cost prototyping through its multi-project wafer (MPW) service whereby multiple chip designs from different companies share a common mask set and wafer to greatly reduce the cost of producing small quantities of die.
IHP will offer MPW runs through Europractice every 12 weeks.
The processes support NPN transistors with maximum oscillation frequencies up to 220GHz.
They are aimed at mixed-signal and analogue IC designs for wireless, broadband and optical communications, high-speed sensing and measurement, and radar applications up to 100GHz.
Collision avoidance systems for the automotive industry is one growing application area requiring devices with the performance offered by SiGe:C.
Aerospace and life sciences equipment are among the others.
Tanner EDA's exclusive agent for Europe is EDA Solutions.
The Tanner Design Kit for IHP's technologies SG25H1 and SG25H3 will be provided by Europractice.
Users of Tanner EDA tools are to get economical access to an analogue and mixed-signal 0.25um silicon germanium carbon (SiGe:C) BiCMOS process through a new collaboration with IHP's pilot line in Frankfurt (Oder). Europractice has developed design kits for Tanner EDA's L-Edit family of integrated circuit layout tools to ensure compatibility of designs with their process. Using the IHP pilot line, Europractice IC Services will provide low-cost prototyping through its multi-project wafer (MPW) service whereby multiple chip designs from different companies share a common mask set and wafer to greatly reduce the cost of producing small quantities of die.
IHP will offer MPW runs through Europractice every 12 weeks.
The processes support NPN transistors with maximum oscillation frequencies up to 220GHz.
They are aimed at mixed-signal and analogue IC designs for wireless, broadband and optical communications, high-speed sensing and measurement, and radar applications up to 100GHz.
Collision avoidance systems for the automotive industry is one growing application area requiring devices with the performance offered by SiGe:C.
Aerospace and life sciences equipment are among the others.
Tanner EDA's exclusive agent for Europe is EDA Solutions.
The Tanner Design Kit for IHP's technologies SG25H1 and SG25H3 will be provided by Europractice.
# posted by Swathi @ 11:12 AM
Monday, April 17, 2006
Power estimation technology donated to Accelera
Atrenta has donated its SpyGlass Design Constraints for low power design to Accellera's Unified Power Format Technical Subcommittee.
Atrenta has donated its SpyGlass Design Constraints (SGDC) for low power design to Accellera's Unified Power Format (UPF) Technical Subcommittee. Atrenta's constraint format enables IC designers to specify design intent for voltage domains and power isolation domains. The format also supports advanced low power techniques at various phases of the design, including RTL, post-synthesis and post-routing.
Atrenta's SpyGlass-Low Power solution has been widely adopted across state-of-the-art production design flows.
Using SpyGlass Low Power, customers can verify that design implementation is aligned with low power design intent.
Atrenta's power estimation technology enables customers to gauge power consumption at RTL to within 20% of silicon-measured power.
Additional capabilities help customers optimise the design for power efficiency, cutting IC power consumption by up to 40%.
'Atrenta's customers will benefit immensely from a low power standard that simplifies low power design', said Dr Ajoy Bose, Chairman, President and CEO of Atrenta.
'At the end of the day, standards are all about customer productivity, which is why we are actively participating in all viable standards initiatives'.
Atrenta has donated its SpyGlass Design Constraints (SGDC) for low power design to Accellera's Unified Power Format (UPF) Technical Subcommittee. Atrenta's constraint format enables IC designers to specify design intent for voltage domains and power isolation domains. The format also supports advanced low power techniques at various phases of the design, including RTL, post-synthesis and post-routing.
Atrenta's SpyGlass-Low Power solution has been widely adopted across state-of-the-art production design flows.
Using SpyGlass Low Power, customers can verify that design implementation is aligned with low power design intent.
Atrenta's power estimation technology enables customers to gauge power consumption at RTL to within 20% of silicon-measured power.
Additional capabilities help customers optimise the design for power efficiency, cutting IC power consumption by up to 40%.
'Atrenta's customers will benefit immensely from a low power standard that simplifies low power design', said Dr Ajoy Bose, Chairman, President and CEO of Atrenta.
'At the end of the day, standards are all about customer productivity, which is why we are actively participating in all viable standards initiatives'.
# posted by Swathi @ 11:15 AM
Sunday, April 16, 2006
Application suite to unify handset applications
Texas Instruments is working with leading application software providers to offer a scalable, integrated application suite to boost development of affordable multimedia feature phones.
Furthering its commitment to accelerate wireless growth in China and high-growth markets worldwide, Texas Instruments is working with leading application software providers to offer a scalable, integrated application suite to boost development of affordable multimedia feature phones. Application suites from an ecosystem of leading software providers are integrated onto TI's LoCosto single-chip value platform and OMAP-Vox multimedia product family for a highly customisable solution on mobile phones. TI customers can select an application suite such as Motorola Ajar, OpenPlug's Elips, Sasken's Aria and Sky MobileMedia's Sky-Map, that can be easily adapted to the unique needs of their handset products and specific operator and consumer requirements.
'Together with its ecosystem of application suite providers, TI is committed to helping its customers differentiate in the highly-competitive wireless market by providing a variety of solutions', said Remi El-Ouazzane, General Manager of TI's 2.5G business for its wireless terminals Business Unit.
'TI's applications suite ecosystem provides multiple pre-integrated offerings based on selected superior solutions, resulting in flexible choices and faster time to market with customised, differentiated products'.
The process of porting, validating and integrating software takes significant monetary and time investment.
TI is committed to helping customers maximise those investments by offering them a choice of pre-integrated application suites, simplifying the development process of mass market multimedia feature phones and reducing time to market by as much as six months.
Each partner provides a unique modular and scalable offering based on a framework which allows development of multiple phone models for various market segments.
This gives handset manufacturers the ability to add or remove applications to best address market and consumer needs.
A common TI software foundation, built with open industry standard APIs, provides for software re-use and easy, consistent migration across TI's LoCosto and OMAP-Vox solutions.
In choosing its ecosystem application suite providers, TI thoroughly evaluates suppliers on multiple selection criteria including: software architecture; scalability; breadth of application components; MMI customisability; robust worldwide engineering support and meeting operator grade compliancy.
The result is that handset manufacturers can choose from a selection of proven, scalable solutions on TI's LoCosto and OMAP-Vox platforms for differentiated feature phone development.
Pre-integrated solutions from TI's application ecosystem partners on the LoCosto platform are available today.
Furthering its commitment to accelerate wireless growth in China and high-growth markets worldwide, Texas Instruments is working with leading application software providers to offer a scalable, integrated application suite to boost development of affordable multimedia feature phones. Application suites from an ecosystem of leading software providers are integrated onto TI's LoCosto single-chip value platform and OMAP-Vox multimedia product family for a highly customisable solution on mobile phones. TI customers can select an application suite such as Motorola Ajar, OpenPlug's Elips, Sasken's Aria and Sky MobileMedia's Sky-Map, that can be easily adapted to the unique needs of their handset products and specific operator and consumer requirements.
'Together with its ecosystem of application suite providers, TI is committed to helping its customers differentiate in the highly-competitive wireless market by providing a variety of solutions', said Remi El-Ouazzane, General Manager of TI's 2.5G business for its wireless terminals Business Unit.
'TI's applications suite ecosystem provides multiple pre-integrated offerings based on selected superior solutions, resulting in flexible choices and faster time to market with customised, differentiated products'.
The process of porting, validating and integrating software takes significant monetary and time investment.
TI is committed to helping customers maximise those investments by offering them a choice of pre-integrated application suites, simplifying the development process of mass market multimedia feature phones and reducing time to market by as much as six months.
Each partner provides a unique modular and scalable offering based on a framework which allows development of multiple phone models for various market segments.
This gives handset manufacturers the ability to add or remove applications to best address market and consumer needs.
A common TI software foundation, built with open industry standard APIs, provides for software re-use and easy, consistent migration across TI's LoCosto and OMAP-Vox solutions.
In choosing its ecosystem application suite providers, TI thoroughly evaluates suppliers on multiple selection criteria including: software architecture; scalability; breadth of application components; MMI customisability; robust worldwide engineering support and meeting operator grade compliancy.
The result is that handset manufacturers can choose from a selection of proven, scalable solutions on TI's LoCosto and OMAP-Vox platforms for differentiated feature phone development.
Pre-integrated solutions from TI's application ecosystem partners on the LoCosto platform are available today.
# posted by Swathi @ 11:08 AM
