Sunday, July 02, 2006
LGA sockets are ready for latest CPUs
RoHs compliant Land Grid Array 771 (LGA771) Socket J for Intel Xeon CPUs and Land Grid Array (LGA775) Socket T for desktop computers are equipped to handle the future of sever technology.
New from Tyco Electronics, the RoHS compliant Land Grid Array 771 (LGA771) Socket J for Intel Xeon CPUs and Land Grid Array (LGA775) Socket T for desktop computers are equipped to handle the future of sever technology. The optimal quality of these sockets assures microprocessor protection for longevity of CPU connection. Built to endure and protect, Tyco Electronics' LGA771 and LGA775 sockets integrate the latest in quality technology to assure consistent performance.
The sockets' high temperature endurance thermoplastic housing material, combined with the stainless steel load plate, securely retain the microprocessor package for connection in a variety of temperature conditions.
With exceptionally precise contact tip geometry and socket housing ribs, LGA771 and LGA775 sockets reduce the risk of contact damage and tip over-bending as a result of improper handling or installation.
'Tyco Electronics' LGA771 and LGA775 sockets incorporate the latest LGA metal contact and direct socket loading technology', comments Kim Whitman, Product Manager, Tyco Electronics logic and memory products.
'The LGA contact and direct socket loading ensure the electrical connection of both the Pentium 4 CPU and the Xeon CPU with the printed circuit board'.
With a single lever handle for actuation and solder ball surface mount technology for printed circuit board attachment, LGA771 and LGA775 sockets are superiorly designed for simple processor installation and PCB integration by the direct socket loading plate.
The pick-and-place cap for automatic processing also serves to further protect the contacts from contamination, allowing for an even longer life of the socket and microprocessor.
New from Tyco Electronics, the RoHS compliant Land Grid Array 771 (LGA771) Socket J for Intel Xeon CPUs and Land Grid Array (LGA775) Socket T for desktop computers are equipped to handle the future of sever technology. The optimal quality of these sockets assures microprocessor protection for longevity of CPU connection. Built to endure and protect, Tyco Electronics' LGA771 and LGA775 sockets integrate the latest in quality technology to assure consistent performance.
The sockets' high temperature endurance thermoplastic housing material, combined with the stainless steel load plate, securely retain the microprocessor package for connection in a variety of temperature conditions.
With exceptionally precise contact tip geometry and socket housing ribs, LGA771 and LGA775 sockets reduce the risk of contact damage and tip over-bending as a result of improper handling or installation.
'Tyco Electronics' LGA771 and LGA775 sockets incorporate the latest LGA metal contact and direct socket loading technology', comments Kim Whitman, Product Manager, Tyco Electronics logic and memory products.
'The LGA contact and direct socket loading ensure the electrical connection of both the Pentium 4 CPU and the Xeon CPU with the printed circuit board'.
With a single lever handle for actuation and solder ball surface mount technology for printed circuit board attachment, LGA771 and LGA775 sockets are superiorly designed for simple processor installation and PCB integration by the direct socket loading plate.
The pick-and-place cap for automatic processing also serves to further protect the contacts from contamination, allowing for an even longer life of the socket and microprocessor.
# posted by Swathi @ 10:00 PM 
