Friday, July 14, 2006
Multilayer ceramic chip coil is smallest
TDK Corporation has announced that production of the MLG0402 chip coils, the industry's smallest multilayer ceramic chip coils, will begin in July 2006.
TDK Corporation has announced that production of the MLG0402 chip coils, the industry's smallest multilayer ceramic chip coils, will begin in July 2006. The inductors, designed for ultra high frequency, represent a major breakthrough in miniaturization with approximately 70% less volume and 55% less mounting area than the 0603-sized coils currently in widespread use. The components also offer an excellent inductance range, up to a maximum of 12 nH.
The size of the new coils will make possible further miniaturization of the module and narrow pitch mounting of numerous devices including cell phones, DECT handsets, high-frequency modules, Bluetooth devices, W-LANs, and digital television tuners.
The components will also allow the addition of new functions to the high-frequency circuit components of various devices in the mobile communications field.
In conjunction with the rapid miniaturization of mobile communications devices such as cell phones as well as the incorporation of multiple functions, there have been strong demands for chip coils to be made more compact.
In response to these calls, TDK has employed its expertise in material and multilayering technologies to develop the industry's first 0402-sized multilayer ceramic high-frequency chip coils.
As well as its compact size, the chip coils offer excellent inductance values, one of the most important characteristics of components used in high-frequency applications.
The MLG0402 series comprises 14 products with inductances from 1.0 nH to 12 nH, allowing set manufacturers to select the ideal coil according to the specific application.
The MLG0402 chip coils measure 0.4 x 0.2 x 0.2 mm (all dimensions +/- 0.02 mm) with tolerance of +/- 0.3 nH and +/- 5%, operating temperature range -55 to +125 deg, and storage temperature range of -55 to +125C.
The components do not include any lead or lead compounds and are suitable for use with lead-free solder, making them RoHS-compliant, completely lead-free products.
TDK Corporation has announced that production of the MLG0402 chip coils, the industry's smallest multilayer ceramic chip coils, will begin in July 2006. The inductors, designed for ultra high frequency, represent a major breakthrough in miniaturization with approximately 70% less volume and 55% less mounting area than the 0603-sized coils currently in widespread use. The components also offer an excellent inductance range, up to a maximum of 12 nH.
The size of the new coils will make possible further miniaturization of the module and narrow pitch mounting of numerous devices including cell phones, DECT handsets, high-frequency modules, Bluetooth devices, W-LANs, and digital television tuners.
The components will also allow the addition of new functions to the high-frequency circuit components of various devices in the mobile communications field.
In conjunction with the rapid miniaturization of mobile communications devices such as cell phones as well as the incorporation of multiple functions, there have been strong demands for chip coils to be made more compact.
In response to these calls, TDK has employed its expertise in material and multilayering technologies to develop the industry's first 0402-sized multilayer ceramic high-frequency chip coils.
As well as its compact size, the chip coils offer excellent inductance values, one of the most important characteristics of components used in high-frequency applications.
The MLG0402 series comprises 14 products with inductances from 1.0 nH to 12 nH, allowing set manufacturers to select the ideal coil according to the specific application.
The MLG0402 chip coils measure 0.4 x 0.2 x 0.2 mm (all dimensions +/- 0.02 mm) with tolerance of +/- 0.3 nH and +/- 5%, operating temperature range -55 to +125 deg, and storage temperature range of -55 to +125C.
The components do not include any lead or lead compounds and are suitable for use with lead-free solder, making them RoHS-compliant, completely lead-free products.
# posted by Swathi @ 1:55 AM 
