Thursday, October 05, 2006
Chip capacitor holds form with temperature
TDK Corporation has announced the availability of its Single Mega Cap 1210 chip.
TDK Corporation has announced the availability of its Single Mega Cap 1210 chip. The chip is smaller in size in comparison to the company's standard Mega Cap, offering the same functionalities. The Single Mega Cap 1210 chip is a single capacitor with special metal frame termination.
This termination allows the chip to be mounted onto a PCB and provides excellent reliability when subjected to high and low temperature changes as well as continuous or temporary movements.
Another benefit of the smaller case size of the Single Mega Cap 1210 chip is a reduction of the mounting area on the PCB.
The chip is ideal in temperature varying applications, as it can match the changes in size of the PCB with terminations that keep it in place.
The design of the Single Mega Cap 1210 chip enables durability by withstanding movement shock.
These features can also assure reliability and endurance to key applications, like in the automotive industry or for telecomms basestations.
This chip also features low ESR, ESL and a high ripple current capability.
The Single Mega Cap 1210 chip is built for excellent performance on metal (AL) substrate and can be used in various applications, including smoothing circuits, power supply, DC/DC convertor, HID and ABS.
TDK Corporation has announced the availability of its Single Mega Cap 1210 chip. The chip is smaller in size in comparison to the company's standard Mega Cap, offering the same functionalities. The Single Mega Cap 1210 chip is a single capacitor with special metal frame termination.
This termination allows the chip to be mounted onto a PCB and provides excellent reliability when subjected to high and low temperature changes as well as continuous or temporary movements.
Another benefit of the smaller case size of the Single Mega Cap 1210 chip is a reduction of the mounting area on the PCB.
The chip is ideal in temperature varying applications, as it can match the changes in size of the PCB with terminations that keep it in place.
The design of the Single Mega Cap 1210 chip enables durability by withstanding movement shock.
These features can also assure reliability and endurance to key applications, like in the automotive industry or for telecomms basestations.
This chip also features low ESR, ESL and a high ripple current capability.
The Single Mega Cap 1210 chip is built for excellent performance on metal (AL) substrate and can be used in various applications, including smoothing circuits, power supply, DC/DC convertor, HID and ABS.