Friday, November 03, 2006

 

Compact inductors handle the heat

Four new series of low-cost low-profile small-footprint high-power surface-mount inductors are ideal for compact high-density board configurations that run at high temperatures.

Four new series of low-cost low-profile small-footprint high-power surface-mount inductors are ideal for compact high-density board configurations that run at high temperatures as they all have an extended operating temperature up to 130C. Each of the series has low DCR, high current ratings and excellent thermal efficiency, but the new PG0137 and PG0083 series have the smallest footprints of them all at just 6.8 x 6.8mm (industry standard 2525 footprint). There are two key design elements that separate the PG0137 and PG0083 series from competing parts.

One is the self-leaded product termination, where the ends of the coil form the solder termination point.

The second is the advanced core material that eliminates the risk of thermal aging.

All the series can be used in any high current rating low profile application.

The wide inductance range enables designers to customise the designs for different inductance needs.

Extended operating temperatures mean that all the devices can be used for high temperature systems, especially on voltage regulator modules used in P4 or higher microprocessors.

This family of series is designed to help manufacturers in lowering the component cost of AC/DC switched-mode power supplies and DC/DC convertors in distributed power architectures (DPA) for high-performance servers and workstations, telecom network switches, routers, basestation equipment, point of load (POL) systems and voltage regulator modules (VRMs).





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