Wednesday, November 29, 2006
Passives offer choice of silicon and ceramic
Comprehensive range of surface mount wire bondable devices consists of resistors, network arrays, capacitors, multitap chip resistors and divider networks on silicon and ceramic.
Providing design engineers with the industry's widest range of wire-bondable resistive devices, TT Electronics IRC Advanced Film Division has developed a comprehensive range of surface mount wire bondable devices. Designated the WBC Series, the family consists of resistors, network arrays, capacitors, multitap chip resistors and divider networks on silicon and ceramic. According to Debasis Roy, Thin Film Business Unit Director for IRC Advanced Film Division, IRC has its own complete in-house silicon production capabilities.
'While most manufacturers produce devices on either silicon or ceramic, IRC manufactures both', said Dr Roy.
'The products in our wire bondable family are produced on both silicon and ceramic, allowing customers to select the technology that is ideal for their application'.
The wire bondable product offering includes: the WBA Series of TaNFilm precision ceramic resistors, with a resistance range of 10ohm to 20kohm; the WBC Series of TaNSil precision silicon resistors, with a resistance range of 10ohm to 1Mohm and TRC tracking to +/-2ppm/C; the WBC-CR Series of Chromaxx precision high range silicon resistors, with a resistance range of 1.01 to 2Mohm, absolute tolerance to +/-1% (ratio tolerance to +/-0.5%), absolute TCRs to +/-100ppm/C, and TRC tracking to +/-5ppm/C; the WBC-Divider Series of TaNSil precision silicon voltage divider networks, with a resistance range of 10ohm to 1Mohm and TRC tracking to +/-2ppm/C; the WBD-NET Series of TaNSil silicon resistor network arrays, with a resistance range of 10ohm to 2.5Mohm; the WBC-CAP Series of TaNCap wire bondable chip capacitors, with capacitance range from 10 to 1000pF and absolute tolerance to +/-0.5%; the WBC-RC Series of TaNSil chip resistors and capacitor circuits, with capacitance range from 47 to 80pF and resistance range from 33 to 100ohm, absolute resistor tolerance to +/-10% and absolute capacitance tolerance to +/-20%; and the WBC-Multitap Series of TaNSil silicon multitap chip resistor networks, with resistance range from 100ohm to 80kohm, and absolute tolerance to +/-5%.
Unless otherwise noted, the devices in the wire bondable family feature absolute tolerance to +/-0.1% (ratio tolerance to +/-0.05%), absolute TCRs to +/-25ppm/C, and TCR tracking to +/-5ppm/C.
Due to their small size and stability, the wire bondable devices are being specified for use in hybrid modules, as well as for applications involving implantable medical electronics and other battery-operated miniature devices.
IRC's proprietary TaNFilm and TaNSil processes produce an ultrastable self-passivating tantalum nitride resistance element that provides exceptional stability, power dissipation and precision.
Providing design engineers with the industry's widest range of wire-bondable resistive devices, TT Electronics IRC Advanced Film Division has developed a comprehensive range of surface mount wire bondable devices. Designated the WBC Series, the family consists of resistors, network arrays, capacitors, multitap chip resistors and divider networks on silicon and ceramic. According to Debasis Roy, Thin Film Business Unit Director for IRC Advanced Film Division, IRC has its own complete in-house silicon production capabilities.
'While most manufacturers produce devices on either silicon or ceramic, IRC manufactures both', said Dr Roy.
'The products in our wire bondable family are produced on both silicon and ceramic, allowing customers to select the technology that is ideal for their application'.
The wire bondable product offering includes: the WBA Series of TaNFilm precision ceramic resistors, with a resistance range of 10ohm to 20kohm; the WBC Series of TaNSil precision silicon resistors, with a resistance range of 10ohm to 1Mohm and TRC tracking to +/-2ppm/C; the WBC-CR Series of Chromaxx precision high range silicon resistors, with a resistance range of 1.01 to 2Mohm, absolute tolerance to +/-1% (ratio tolerance to +/-0.5%), absolute TCRs to +/-100ppm/C, and TRC tracking to +/-5ppm/C; the WBC-Divider Series of TaNSil precision silicon voltage divider networks, with a resistance range of 10ohm to 1Mohm and TRC tracking to +/-2ppm/C; the WBD-NET Series of TaNSil silicon resistor network arrays, with a resistance range of 10ohm to 2.5Mohm; the WBC-CAP Series of TaNCap wire bondable chip capacitors, with capacitance range from 10 to 1000pF and absolute tolerance to +/-0.5%; the WBC-RC Series of TaNSil chip resistors and capacitor circuits, with capacitance range from 47 to 80pF and resistance range from 33 to 100ohm, absolute resistor tolerance to +/-10% and absolute capacitance tolerance to +/-20%; and the WBC-Multitap Series of TaNSil silicon multitap chip resistor networks, with resistance range from 100ohm to 80kohm, and absolute tolerance to +/-5%.
Unless otherwise noted, the devices in the wire bondable family feature absolute tolerance to +/-0.1% (ratio tolerance to +/-0.05%), absolute TCRs to +/-25ppm/C, and TCR tracking to +/-5ppm/C.
Due to their small size and stability, the wire bondable devices are being specified for use in hybrid modules, as well as for applications involving implantable medical electronics and other battery-operated miniature devices.
IRC's proprietary TaNFilm and TaNSil processes produce an ultrastable self-passivating tantalum nitride resistance element that provides exceptional stability, power dissipation and precision.
# posted by Swathi @ 2:09 AM 
